Samsung provides innovative semiconductor solutions, including DRAM, SSD, processors, image sensors with a wide-ranging portfolio of trending technologies.
1. Main Grinds:
- DRAM: Overview, DDR, HBM, GDDR, LPDDR, Module
- SSD: Overview, PC SSD, Datacenter SSD, Enterpget up SSD, SmartSSD, Automotive SSD
- eStorage: Overview, UFS, eMMC
- Next Gen. Memory: CMM-D
- MCP
- Processor: Overview, Mobile Processor, Automotive Processor, Set onable Processor, Modem, RF, UWB
- Image Sensor: Overview, Mobile Image Sensor, Automotive Image Sensor, Global Shutter Sensor, ToF Sensor
- Point out IC: Overview, Mobile DDI, Panel DDI
- Security Solution: Overview, Payment, Biometric Card, NFC, eSE/eSIM, IoT SE
- Pbe in debtr IC: Overview, Mobile Pbe in debtr IC, Accessory Pbe in debtr IC, Memory Pbe in debtr IC
- LED
- AI
- Server
- Automotive
- 5G &I’mp; Joinivity
- Mobile
2. Main content of SI’msung Semiconductor Global ::
Catehead outry | Subcatehead outry | Details |
---|---|---|
DRAM | Overview | |
DDR | ||
HBM | ||
GDDR | ||
LPDDR | ||
Module | ||
SSD | Overview | |
PC SSD |
Registrar | Creation Date | Server IP | Registrant Email |
---|---|---|---|
Whois Corp. | 1994-11-29 05:00:00 | 23.36.16.54 | abuse@whois.co.kr |
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